JPH0452997Y2 - - Google Patents

Info

Publication number
JPH0452997Y2
JPH0452997Y2 JP1987138838U JP13883887U JPH0452997Y2 JP H0452997 Y2 JPH0452997 Y2 JP H0452997Y2 JP 1987138838 U JP1987138838 U JP 1987138838U JP 13883887 U JP13883887 U JP 13883887U JP H0452997 Y2 JPH0452997 Y2 JP H0452997Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
protrusion
sealing frame
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987138838U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6444637U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987138838U priority Critical patent/JPH0452997Y2/ja
Publication of JPS6444637U publication Critical patent/JPS6444637U/ja
Application granted granted Critical
Publication of JPH0452997Y2 publication Critical patent/JPH0452997Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987138838U 1987-09-12 1987-09-12 Expired JPH0452997Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138838U JPH0452997Y2 (en]) 1987-09-12 1987-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138838U JPH0452997Y2 (en]) 1987-09-12 1987-09-12

Publications (2)

Publication Number Publication Date
JPS6444637U JPS6444637U (en]) 1989-03-16
JPH0452997Y2 true JPH0452997Y2 (en]) 1992-12-14

Family

ID=31401547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138838U Expired JPH0452997Y2 (en]) 1987-09-12 1987-09-12

Country Status (1)

Country Link
JP (1) JPH0452997Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294993A (ja) * 1994-03-11 2007-11-08 Quantum Leap Packaging Inc 組立て型半導体チップキャリア

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236541U (en]) * 1985-08-20 1987-03-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294993A (ja) * 1994-03-11 2007-11-08 Quantum Leap Packaging Inc 組立て型半導体チップキャリア

Also Published As

Publication number Publication date
JPS6444637U (en]) 1989-03-16

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